Passive, high-efficiency heat transfer device that can be embedded directly into components or assemblies – offering rapid heat transport over distance with minimal temperature gradient.
Passive, high-efficiency heat transfer device that can be embedded directly into components or assemblies – offering rapid heat transport over distance with minimal temperature gradient.
• Passive high-capacity heat transport (via phase-change)
• Custom form factors (diameter, length, bends)
• Material and fluid flexibility – copper, stainless steel or aluminium
• Insertable or bonded design for seamless integration
• Orientation-tolerant options with sintered wick structures
Applications
Heat-pipe-enhanced cold plates or heat sinks in HVAC modules, thermal bridges in compact heat-pump systems, power electronics cooling, server and data-centre cooling, heat transfer from embedded heating elements to system fluids.
Looking for a solution? We design your skived-fin, profile / heat-pipe or cold-plate geometry precisely to your load, coolant and form-factor requirements. Contact us today.
